Program

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Tuesday, April 13th, 2010

from 20:30Reception

Wednesday, April 14th, 2010

8:00 - 9:00Registration
9:00 - 9:10Opening
9:10 - 10:40Session I: Contact Formation I
Matthias Hörteis (invited)ISEFundamental reactions during the formation of fired silver contacts and cell results
Stefanie RiegelUKONOn the metallization of boron back surface fields
Felix HaaseISFHEffects of metallization in the semiconductor part – insights from experiments and device modeling
Maria RecamanIMECScreen-Printing on high sheet resistance epitaxial emitters
10:40 - 11:00Coffee break
11:00 - 12:10Session II: Contact Formation II
Elias UrrejolaISCAl-Si alloy formation in narrow p-Si contact areas
Luca GauteroISECharacterisation of local Al BSF formation for PERC solar cell structures
Agnes MeweECNMetallization pattern optimization for open rear side cells
12:10 - 13:10Lunch break
13:10 - 14:40Session III: Paste Development
Aba Ebong (invited)GITUnderstanding and implementing high quality contacts to advanced emitters for high efficiency solar cells
Rene Hönig ISEPaste development for screen printed mc-Si MWT solar cells exceeding 17% efficiency
Harald KerpFerroFront silver and aluminium back surface field metallizations for achieving high performance crystalline silicon solar cells
Giovanna LaudisioDuPontA view of the design challenges involved in the development of advanced n-type contacts using lead-free chemistries
14:40 - 15:00Coffee break
15:00 - 16:30Session IV: Printing
Jaap Hoornstra (invited)ECNThick film printing: towards fine line high aspect ratio
Marco GalIiazzoApplied Materials BacciniReliable double printing of Ag contacts for c-Si cell manufacturing
Frank Kleine JägerBASFBASF’s CypoSolTM metallization inks for newly developed Laser Transfer Printing (LTP) technology
Tom FalconDEKDevelopment of a ‘Print on Print’ process to create high aspect ratio front side conductors on silicon solar cells.
16:30 - 16:50Coffee break
16:50 - 18:00Session V: Jetting
Armin RichterISEAerosol jet printed contact formation for highly doped boron emitters of n-type solar cells with front side junction
Maikel van HestNRELDirect write approaches for metallization
Sebastian BinderISEMetallization - what an ideal metallization ink should look like
19:00Dinner

Thursday, April 15th, 2010

9:00 - 10:30Session VI: Plating
Jose Luis Hernandez (invited)IMECFront side metallization of silicon solar cells by Copper-plating
Jonas BartschISE"Copper as conducting layer in the front side metallization of crystalline silicon solar cells – Processes, challenges and characterization"
Caroline BoulordINESCharacterization and optimization of electroless nickel plating for front side silicon solar cells metallization
Andrew MondonISEAdvanced front side metallization for crystalline silicon solar cells based on a nickel-silicon contact
10:30 - 10:50Coffee break
10:50 - 12:00Session VII: Technology
Frank HeinemeyerISFHInline-high-rate thermal evaporation of aluminium for novel industrial solar cell metallization
Jan NekardaISEIndustrial inline PVD metallization for highly efficient crystalline silicon solar cells
Willem-Jan de WijsPhilips AppTechNew technological approach to sintering and contact formation
12:00 - 13:00Lunch break
13:00 - 14:30Session VIII: Metallization & Modules
Harry Wirth (invited)ISESolder joint formation and testing on cell busbars
Paul Grunow (invited)pi BerlinSoldering of crystalline silicon modules: Losses, reliability and improvements
Marc Köntges (invited)ISFHRequirements on metallization schemes on solar cells with focus on photovoltaic modules
Ian Bennett (invited)ECNModule integration of back-contact cells: compatibility and durability
14:30 - 15:00Closing
15:00 - 15:30Coffee break